The Board of Directors of JF TECH is pleased to announce that its wholly-owned subsidiary, JF Microtechnology Sdn. Bhd. ("JFM"), has been granted a patent for an invention titled "Electrical Interconnect Assembly", Patent No. 8,952,714 ("the Patent") by the United States Patent an Trademark Office ("USPTO") on 10 February 2015.

The Patent has been granted to JFM as patent owner of its key product, namely ZIGMA products and has tenure of a period of twenty (20) years commencing from the date of application, 23 November 2013. 

The Board of Directors of JF TECH is pleased to inform that this would have a positive impact to the Complaint for Patent Infringement filed by Johnstech International Corp. (“JTI”) in the United States District Court for the Northern District of California against JF TECH, JFM, and J Foong Technologies Sdn. Bhd.   for the Infringement of United States Patent No. 7,059,866 entitled "Integrated Circuit Test Contact to Test Apparatus" ("866 Patent"). Kindly refer to JFT’s announcements on the aforesaid Complaint on 27 June 2014 and 7 August 2014 for further information.

This announcement is dated 10 February 2015.